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Profile specifications
NOTE: The profiles discussed by WG5 shall not violate 3GPP specifications
O&M requirements
IOT specifications
Potential enhancements of 3GPP specifications (F1/E1/W1/X2/Xn)
Specification of D2 interface between O-DUs
Profile 3GPP-specified higher layer split interfaces to be truly inter-operable between vendors (focus on X2, F1, Xn, E1 and W1 interfaces). Specify D2 interface for inter-operability between O-DUs. Specify interoperability testcases and specify requirements for operation & maintenance for O-DU, O-CU-CP and O-CU-UP. WG5 also profiles user plane procedures and functions and defines a transport specification to enhance openness for the network elements within its scope.
NTT DOCOMO, INC. (DCM): Ryusuke Matsukawa
Rakuten Mobile Inc (RMI): Veluchamy Lingasamy
Ericsson (ERI): Kurt Essigmann